| Weizhi Li | 2024.09 | Thermal Management in FPGA and 3DIC |
| Songxuan He | 2024.09 | Design and Methodology for Circuit Aging |
| Chuhao Chen | 2024.09 | Radiation aware EDA |
| Minghui Dong | 2024.09 | Parameter Extraction and AI assisted Device Modeling |
| Runsheng Liu | 2024.09 | Reliability based Hardware Trojan |
| Ling Xiong | 2023.09 | Reliability-aware Design Technology Co-optimization |
| Zhengxin Zhang | 2023.09 | Radiation Hardening for Stacked Device Technology |
| Binyu Yin | 2023.09 | Electromigration Modeling and Simulation |
| Jiahui Chen | 2022.09 | Design and Optimization of MWIR Detector |
| Haifeng Chen | 2022.09 | Thermal Modeling and Monitoring |
| Jianwen Lin | 2022.09 | Machine Learning assisted Radiation Effects Modeling |
| Haoyu Zhang | 2022.09 | Advanced Interconnect Soultion for BEOL |
| Yaoyang Lyu | 2021.09 | Machine Learning assisted Device Modeling |
| Mingyue Zheng | 2021.09 | Temperature-immune and Reliability-aware Design Method |
| Yutao Chen | 2021.09 | Single-event Effect Simulation and Radiation Hardening |
